SVS product
Scientific Value Solutions Corp
Au Plating
System overview | |
---|---|
Application | Plating |
Wafer size | 4”/6”/8”/12” |
Characteristics | Semiconductor Electroplating System for Advanced Package |
Features | • Face up type single wafer wet processor • Excellent wet state of wafer surface • Excellent thickness uniformity • Convenient user interface and Easy maintenance • Built in spin rinse/dry unit • Competitive CoO |
SVS COMPANY
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