SVS product
Scientific Value Solutions Corp
JIKJI-77
| System overview | |
|---|---|
| Application | Bump, Cu Pillar, TSV |
| Wafer size | 4”/6”/8”/12” |
| Characteristics | Semiconductor Electroplating System for Advanced Package |
| Features | • Face up type single wafer wet processor • Excellent wet state of wafer surface • Excellent thickness uniformity • Convenient user interface and Easy maintenance • Built in spin rinse/dry unit • Competitive CoO |
JIKJI-77
| System overview | |
|---|---|
| Application | Bump, Cu Pillar, TSV |
| Wafer size | 4”/6”/8”/12” |
| Characteristics | Semiconductor Electroplating System for Advanced Package |
| Features | • Face up type single wafer wet processor • Excellent wet state of wafer surface • Excellent thickness uniformity • Convenient user interface and Easy maintenance • Built in spin rinse/dry unit • Competitive CoO |
JIKJI-77
| System overview | |
|---|---|
| Application | JIKJI-77 Single Chamber Processor |
| Wafer size | - |
| Substrate | - |
| Features | Multi 설비의 각 공정을 개별화 된 설비 |
SVS COMPANY
SVS의 장비를 국내,외 메이저 반도체 칩 제조사들이 도입하여
양산 장비로 운용 함으로써 기술적 우수성과 신뢰성을 인정 받고 있습니다.