SVS product
Scientific Value Solutions Corp
MSX 3000B
Modular Spin Multiprocess
| System overview | |
|---|---|
| Application | Semiconductor BUMP, FIWLP Resist, PI Coating/Developing |
| Wafer size | 8" / 12" |
| Substrate | Si, MEMS, Glass |
| Features | • Optimized design of coater unit to high viscosity PR applications • Capability of thick PR application (coating, develop and baking) |
MSX 3000F
Modular Spin Multiprocess
| System overview | |
|---|---|
| Application | Semiconductor FOWLP Resist, PI Coating/Developing |
| Wafer size | 12′′ |
| Substrate | Si, Glass, EMC |
| Features | • Capability of handling wafer with large warpage (≤±5mm) • Small footprint • Include EFEM (3FOUP) |
MSX 3000C
Modular Spin Multiprocess
| System overview | |
|---|---|
| Application | Flux cleaning |
| Wafer size | 8" / 12" |
| Substrate | Si, Glass |
| Features | • SECS/GEM communication • Convenience GUI environment operation • Onboard Windows-based PC control • Enclosed system |
MSX 3000B
Modular Spin Multiprocess
| System overview | |
|---|---|
| Application | Semiconductor BUMP, FIWLP Resist, PI Coating/Developing |
| Wafer size | 8" / 12" |
| Substrate | Si, MEMS, Glass |
| Features | • Optimized design of coater unit to high viscosity PR applications • Capability of thick PR application (coating, develop and baking) |
MSX 3000F
Modular Spin Multiprocess
| System overview | |
|---|---|
| Application | Semiconductor FOWLP Resist, PI Coating/Developing |
| Wafer size | 12′′ |
| Substrate | Si, Glass, EMC |
| Features | • Capability of handling wafer with large warpage (≤±5mm) • Small footprint • Include EFEM (3FOUP) |
SVS COMPANY
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양산 장비로 운용 함으로써 기술적 우수성과 신뢰성을 인정 받고 있습니다.